Cleaning & Recovery
Testing & Analysis
News & Blog
News & Blog
Cardboard Contamination Causes Creep Corrosion Conundrum
They couldn’t understand it. Their new Immersion Silver Printed Circuit Board Assemblies (PCBAs) were experiencing corrosion, but the electronics company had examined its own materials and methods...
Total Versatility: X-ray Fluorescence
Need to determine whether a solder alloy has the proper concentration of silver? Do you ever want to know whether assemblies are RoHS compliant? It can all be done with one single method: X-ray...
Clean and mean, the road to reliability
With Revisions by Dave Mohr Contaminants remaining on an electronics assembly as a result of the product’s manufacturing process can contribute to unexpected field failures. Learn which test...
Does medical device reliability worry you sick?
Contaminants that find their way into critical performance devices before, during or even after manufacturing can cause serious consequences. Originally Published in SMT007 Magazine, November...
X-ray inspection helps manufacturers identify defects hidden within their printed circuit boards and electronic components.
Cross-sectioning is a common reliability test method used to expose inner details of circuit boards normally hidden to the eye. It is most commonly used in the electronics industry to identify...
Beyond surface residues: new ways to diagnose performance issues
Many of our clients know us as a surface residues expert, but our growing lineup of new reliability test methods is an equally important part of our story.
Staying inside the lines: flux contamination from selective solder process
Flux applied outside of the contact area escapes the high temperatures necessary to render it benign.
Flux entrapment under low-standoff components
Redesigning the ground pad to increase standoff height resolves PCB cleanliness issues in both no-clean and water-soluble flux environments.
What the C3 Corrosivity Index™ Means For Contamination Testing
The C3 Corrosivity Index™ is an indicator of the cleanliness of a test site, and is calculated by dividing the maximum current seen during the test by the elapsed time of the test. It provides a...
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